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DGIST develops passive cooling film that uses airborne moisture to cool electronics
Коротко
The Daegu Gyeongbuk Institute of Science and Technology (DGIST) said on Oct. 6 that its research team developed a passive cooling film that absorbs moisture from the air and releases it as heat is generated, lowering device surface temperatures without water or electricity. The team combined nanocellulose with organic ionic molecules to make a flexible, adhesive film that it says does not corrode devices. The researchers present it as a potential answer to heat management in AI data centers, mobile devices and electric vehicle batteries.
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The Daegu Gyeongbuk Institute of Science and Technology (DGIST) said on Oct. 6 that its research team developed a next-generation passive cooling film material that uses moisture in the air to lower the temperature of electronic devices without water or electricity. The institute presented the technology as a way to address heat management in AI data centers, mobile devices and electric vehicle batteries, which the outlets describe as demanding large amounts of power and cooling water. [ 1 , 2 , 3 ]
According to DGIST, the team combined nanocellulose, which stores moisture well, with organic ionic molecules that absorb moisture, synthesizing a flexible and adhesive film. The film takes in moisture from the air and releases it through evaporation when the device generates heat, lowering the temperature. Because it does not corrode devices even while holding moisture, the institute said it can be attached without a separate coating treatment, and it remains strongly adhesive and flexible when fully dry, allowing use on metal, semiconductor and glass surfaces. [ 2 , 3 ]
Kyunghyang Shinmun reported that in a test under continuous device operation, the film held surface temperatures down by as much as 18.2 degrees Celsius for more than 12 hours, from 72.3C to 54.1C. The other documents did not give measured cooling figures. [ 3 ]
The outlets frame the work against a background of rising data center numbers and the limits of existing methods. DGIST said active cooling with pumps and fans requires electricity and refrigerant and is complex and costly to maintain, while earlier evaporation cooling approaches using airborne moisture were hard to attach to device surfaces and caused corrosion because most moisture-absorbing materials are rigid crystalline solids. [ 2 , 3 ]
Professor Kim Sung-kyun of DGIST’s Department of Chemical Physics said, according to both Yonhap and Kyunghyang Shinmun, that the research is significant not simply as an eco-friendly material but because it suggests a direction for overcoming corrosion, flexibility and adhesion limits of existing passive cooling materials at once. Yonhap reported the work was supported by the Ministry of Science and ICT’s individual basic research program and DGIST’s international joint research program, was led by doctoral student Kim Hyun-do, and was published last month in the international journal Small Structures. [ 2 , 3 ]
The outlets emphasized different applications: Yonhap led on cooling AI data centers, while Kyunghyang Shinmun’s headline focused on electric vehicle battery cooling. Both cited data centers, mobile devices and electric vehicle batteries as target uses. [ 2 , 3 ]
Почему это важно
The research points to a possible way to cut the power and water that cooling data centers and batteries currently require, though the documents describe a laboratory material, not a product. As AI data centers multiply, demand for cooling power and water is described by the outlets as a growing task. Any practical effect would depend on commercialization, which the documents do not address.
Ключевые факты
- DGIST said on Oct. 6 that it developed a next-generation passive cooling film material that uses moisture in the air to cool electronic devices without water or electricity. [ 1 , 2 , 3 ]
- The team combined nanocellulose, which stores moisture well, with organic ionic molecules that absorb moisture, forming a film. [ 2 , 3 ]
- The film absorbs moisture from the air and releases it as evaporation when the device generates heat, lowering the temperature. [ 2 ]
- The material does not corrode devices even while holding moisture, so it can be attached without a separate coating, and it remains strongly adhesive and flexible when fully dry. [ 2 ]
- Kyunghyang Shinmun reported that in a continuous operating test the film held device surface temperatures down by as much as 18.2 degrees Celsius for more than 12 hours (from 72.3C to 54.1C). [ 3 ]
- Professor Kim Sung-kyun of DGIST’s Department of Chemical Physics said the study suggests a direction for overcoming several limits of existing passive cooling materials at once. [ 2 , 3 ]
- Yonhap reported the study was supported by the Ministry of Science and ICT’s individual basic research program and DGIST’s international joint research program, was led by doctoral student Kim Hyun-do, and was published last month in the international journal Small Structures. [ 2 ]
Подтверждено несколькими источниками
- DGIST announced on Oct. 6 that it developed a passive cooling film material that uses airborne moisture to cool electronics without water or electricity. [ 1 , 2 , 3 ]
- The material is made by combining nanocellulose with organic ionic molecules with strong moisture-absorbing properties. [ 2 , 3 ]
- The researchers say the film overcomes problems of earlier moisture-based cooling approaches, which were hard to attach to device surfaces and caused corrosion. [ 2 , 3 ]
- DGIST presents the technology as applicable to heat management in AI data centers, mobile devices and electric vehicle batteries. [ 2 , 3 ]
- Professor Kim Sung-kyun is quoted saying the study offers a direction for overcoming several limits of existing passive cooling materials at once. [ 2 , 3 ]
Пока неясно
- The reported cooling performance of up to 18.2 degrees Celsius over more than 12 hours is stated only by Kyunghyang Shinmun. Single-source figure; the other documents do not give measured results.
- Cost, production scale and a commercialization timeline for the film are not stated in any document. The documents describe a research result only, with no details on manufacture or deployment.
- Whether the research was published in the journal Small Structures is stated only by Yonhap. Mentioned by one outlet; the other documents do not refer to the journal.